System Specifications
- Load-Lock chamber
pumped with a CTI-8F cryogenic pump. Includes substrate pre-heat.
- Process chamber pumped
with a CTI-8 cryo pump
- Mechanical vacuum pump
for process chamber and Load-lock roughing.
- Tooling: Continuous
pallet loading In and Out. Up to 12” substrate.
- Three “Inset” cathode
assemblies.
- Upgraded AE MDX10,
10kW DC Magnetron power supply switched between targets.
- Etch/clean: RF etch
station located in main process chamber.
- Includes upgraded ENI
ACG-10B RF Generator.
- Control system: OEM
computer control system for automatic sequencing..
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