|
|
Vacuum,
sputtering, evaporation and etch systems
| Applied
Materials |
Leybold |
| Balzers |
MRC |
| CHA
Industries |
Matrix |
| Circuit
Process Apparatus (CPA) |
Nordiko |
| Commonwealth
Scientific |
Oxford
Instruments |
| Comptech |
Perkin Elmer |
| CVC Products |
Plasma
Technologies |
| Davis @
Wilder (D&W) |
Plasma-Therm |
| Denton
Vacuum |
SEGI sputtering systems |
| Edwards |
Technics |
| Ion Tech |
Tegal |
| Branson |
Temescal /
BOC |
| Kurt J
Lesker |
Tokyo
Electron (TEL) |
| Lam Research |
Varian |
|
Veeco |
Product
flexibility:
Systems may be configured to meet your specific needs.
| Control
Systems: |
Manual
control, semi-automatic, one-button automation. |
| Pumping
system: |
Cryogenic
pumps, Diffusion Pumps, Turbomolecular pumps. |
| Evaporation
source(s): |
Resistance
Sources, Single or Multi Pocket Electron Beam Gun. |
| Sputter
Source(s): |
RF Diode,
RF Magnetron, DC Magnetron. |
| Substrate
cleaning: |
RF etch,
Ion beam milling |
Please
contact
Semicore Equipment for further information, prices and availability.
|
