- 900 Series In Line Sputtering System.
- Load-lock chamber with CTI On-board cryo pump
- Main process chamber with CTI On-board cryo pump.
- Three DC magnetron target assemblies.
- Target 1: Ti material, MU Inset cathode
- Target 2: Au material, UPSILON Inset cathode, single piece
- Target 3: TiW, MU Inset cathode
- AE MDX 10kW DC sputtering power supply.
- RF Sputter Etch Station with AE RFG 1250 RF generator w/ auto tune matching network.
- Single process gas, MFC calibrated 100 sccm Ar.
- Polycold compressor with water pump in process chamber.
- Computer control system for on-button operation.
- 208V, 3 Ph, 50/60 Hz.
