- Versatile, Compact Design
Their compact design makes our circular magnetron sputtering system ideal for any new or retrofit application, including the most complex cluster assemblies for the smallest vacuum chambers. Available in HV and UHV configuration.
- Total Power Compatibility
Low-impedance heads provide DC Magnetron Sputtering, RF Sputtering, mid-frequency DC, pulsed DC, and microwave power compatibility.
- Standard Fittings
We use ISO NW standard fittings, as well as Conflat® metal seal flanges. All utilities are maintained at atmosphere and accessed through standard O-ring compression fittings for easy installation in any vacuum system.
- Full Range of Sizes
Circular magnetron sputter sources are available from 1 through 16 inch target diameters in either standard or custom configurations.
- Quick, Easy Target Change
Our patented threaded target clamp and anode shield allow you to change targets without the use of ancillary tools. Their built-in adjustability also lets you fit targets of varying thickness without resorting to spacing devices.
- Lower, Pressure, High Power
SP400 series magnetron sputtering systems can operate at extremely low pressure (down to the 10-4 Torr range), and our direct cooled designs can deliver power densities up to 250 watts/in2 (30 watts/cm2).
- High Rates and Performance
With higher power densities, you can coat a substrate faster. So Semicore’s maximizes both your coating zone and your target utilization (usually in the 40% range) without a trade-off in rate.
- Greater Uniformity
Thanks to our patented profiled magnets, our circular magnetrons also deliver much greater uniformity of deposition – routinely in the ± 3-5% range.
Whatever your needs in DC Magnetron Sputtering, RF Sputtering, Mid-frequency AC, or pulsed DC Magnetron Sputtering equipment, Semicore is here to help you!
For conventional top down sputtering, only one material will be able to be sputtered at a time. This is because of the geometric relation that the magnetron has with the substrate. Generally when sputtering in this way, the target material must be larger than the substrate to yield acceptable film uniformity… Read More
One popular method of Physical Vapor Deposition (PVD) is Sputtering, which has numerous product applications. Whereas commercial magnetron sputtering systems are often geared to large scale production volume of established processes, there is also a need for smaller scale sputtering systems for research and development where versatility is generally more important than volume throughput. These same smaller sputtering systems can also serve for lower volume initial production… Read More