Sputtering Yield Rates

Sputter DepositionSemicore Equipment Inc. is a worldwide thin film technology leader providing sputtering equipment, sputtering targets and custom vacuum engineering solutions.

The following table of common sputtering target materials is useful in making comparisons between thin film deposition processes. The second column shows the maximum theoretical Density of each PVD coating material. While this density has no bearing on sputtering rate yields, higher density targets (as close as possible to the theoretical maximum) last longer and have fewer voids or inclusions, so they provide better films.

The sputtering “Yield” calculation data in the third column represents the number of target atoms sputtered (ejected from the target) per argon ion striking the target with a kinetic energy of 600 ev. This energy is typical for an Argon plasma. Magnetron design factors such as the magnetic field strength (and process parameters such as gas composition and pressure) will affect these data, of course. But they remain useful for comparison purposes.

The “Rate” data are representative of the thin film deposition rate calculated at maximum power density (i.e. about 250 w/in2, with direct cooling) and a 4″ source to substrate distance. The rates will decrease linearly with lower power levels. With all other factors unchanged, the film deposition rate will:

  • Decrease by approximately 25% per inch beyond the 4″ source to substrate distance.
  • Increase by approximately 35% per inch closer than the 4″ substrate distance.

Target Material

Density (g/cc)

Yield @ 600 ev

Rate* (Å/sec)

Ag10.53.4380
Al2.71.2170
Al98Cu22.82170
Al2O33.9640
Al99Si12.66160
Au19.312.8320
Be1.850.8100
B4C2.5220
BN2.2520
C2.250.220
Co8.91.4190
Cr7.21.3180
Cu8.922.3320
Fe7.861.3180
Ge5.351.2160
Hf13.310.8110
In7.3800
In2O37.1820
ITO7.120
Ir22.421.2135
Mg1.741.4200
MgO3.5820
Mn7.21.3180
Mo10.20.9120
MoS24.840
MoSi26.31110
Nb8.570.680
Ni8.91.5190
Ni81Fe198.8110
Ni80Cr208.5140
Ni93V78.6100
Os22.480.9120
Pd12.022.4270
Pt21.451.6205
Re20.530.9120
Rh12.41.5190
Ru12.31.3180
Si2.330.580
SiC3.2250
SiO22.6370
Si3N43.4440
Sn5.75800
SnO6.4520
Ta16.60.685
TaN16.340
Ta2O58.240
Th11.70.785
Ti4.50.680
TiN5.2240
TiO24.2640
U19.051155
V5.960.785
W19.350.680
W90Ti1014.680
WC15.6350
Y4.470.685
YBCO5.4110
Zn7.14340
ZnO5.6140
ZnS3.9810
Zr6.490.785
ZrO25.640

* The above sputtering yield rates are provided as a comparison. Specific thin film deposition rate calculations will vary based upon PVD coating system design and process parameters.

 

Semicore Equipment Inc is the worldwide thin film technology leader providing sputtering equipment and custom vacuum engineering solutions. Please allow our helpful support staff to answer any questions you have regarding Sputtering Yield Rates and how to implement the best techniques and Sputtering Targets for your specific  needs by contacting us at sales@semicore.com or by calling 925-373-8201

 

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