Sputtering Targets & Deposition Materials

Sputtering TargetsSemicore offers a wide assortment of sputtering targets and thin film deposition materials that complement our PVD Coating systems satisfying virtually any requirement.

Our sputtering targets come in a wide variety of sizes and materials, including pure elements or compounds and alloys in purities ranging from commercial grade 99.9% purity to the highest, 99.999% zone refined Ultra-Pure grade.

We supply the most commonly requested target shapes – round, rectangular, Ring, ConMag, Quantum, S-Gun – as well as the more conventional sizes. If we do not have the shape you need, we can create a custom sputter targets order for you with any of the materials and purities we carry.

The table below shows the wide range of materials we offer. Please use the link below to request a quote for sputtering targets. If you don’t see the material options you are looking for please contact us and our experienced support team will be happy to assist you.

Tell us what vacuum deposition equipment you are using and we can provide you the specifications you need. We supply pure PVD metal targets including gold sputtering targets, titanium-aluminum, vanadium molybdenum and niobium alloy compound targets, rotatable targets as well as small bench top coater targets often used for R&D applications.

We can help you determine the deposition materials you need to match your physical deposition requirements, and can help you formulate the best alloys and compounds to meet your exact thin film coating specifications.

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MaterialsCompositionSputtering
Targets
E-Beam
Sources
Evap.
Mat’ls
Purities
METALS
ALUMINUMAlxxx99.99- 99.9999%
ANTIMONYSbxxx99.999- 99.99999%
ARSENICAsx99, 99.999%
BARIUMBaxx99.5%
BERYLLIUMBexxx98- 99.9%
BISMUTHBixxx99.9, 99.999%
BORONBxx99.5%
CADMIUMCdxxx99.999%
CALCIUMCax99.5%
CARBONCxxx99.999%
CERIUMCexx99.9%
CESIUMCsx99.95%
CHROMIUMCrxxx99.95%
COBALTCoxxx99.9%
COPPERCuxxx99.99, 99.999%
DYSPROSIUMDyx99.9%
ERBIUMErx99.9%
GADOLINIUMGdx99.9%
GALLIUMGax99.999, 99.9999%
GERMANIUMGexxx99.999%
GOLDAuxxx99.99, 99.999%
HAFNIUMHfxxx99.9%
HOLMIUMHox99.9%
INDIUMInxxx99.99- 99.9999%
IRIDIUMIrxxx99.9%
IRONFexxx99.9 99.95%
LANTHANUMLax99.9%
LEADPbxxx99.995%
MAGNESIUMMgxxx99.95%
MANGANESEMnxxx99.9%
MOLYBDENUMMoxxx99.95%
NEODYMIUMNdxxx99.9%
NICKELNixxx99.7, 99.995%
NIOBIUMNbxxx99.95%
PALLADIUMPdxxx99.95%
PLATINUMPtxxx99.99%
PRASEODYMIUMPrxxx99.9%
RHENIUMRexxx99.9%
RUBIDIUMRbxxx99.8%
RUTHENIUMRuxxx99.9%
SAMARIUMSmx99.9%
SCANDIUMScx99.9%
SELENIUMSexxx99.999- 99.9999%
SILICONSixxx99.999%
SILVERAgxxx99.99%
STRONTIUMSrx99.5%
TANTALUMTaxxx99.95%
TELLURIUMTexxx99.999%
TERBIUMTbx99.9%
THALLIUMTlx99.9%
THORIUMThx99.8%
THULIUMTmx99.9%
TINSnxxx99.99%
TITANIUMTixxx99.7- 99.995%
TUNGSTENWxxx99.95%
VANADIUMVxxx99.9%
YTTERBIUMYbxxx99.9%
YTTRIUMYxxx99.9%
ZINCZnxxx99.99, 99.995%
ZIRCONIUMZrxxx99.7%
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ALLOYS
ALUMINUM – CHROMIUM(Al)X (Cr)1-Xxxx99.99%
ALUMINUM – COBALT(Al)X (Co)1-Xxxx99.95%
ALUMINUM- COPPER(Al)X (Cu)1-Xxxx99.9- 99.9999%
ALUMINUM – IRON(Al)X (Fe)1-Xxxx99.99%
ALUMINUM – SILICON(Al)X (Si)1-Xxxx99.9- 99.9999%
ALUMINUM – SILICON – COPPER(Al)X (Si)Y (Cu)Zxxx99.9- 99.9999%
ALUMINUM – TITANIUM(Al)50 (Ti)50xxx99.95%
CHROMIUM – SILICON MONOXIDE(Cr)X (SiO)1-Xxxx99.9%
CHROMIUM – NICKEL(Cr)X(Ni)1-Xxxx99.9%
CHROMIUM – COBALT(Cr)X(Co)1-Xxxx99.5%
CHROMIUM – COBALT – NICKEL(Cr)X (Co)Y (Ni)Zxxx99.5%
COBALT – NICKEL(Co)X(Ni)1-Xxxx99.5%
IRON – NICKEL (PERMALLOY)(Fe)19 (Ni)81xxx99.9%
INDIUM – TIN(In)X (Sn)1-Xxxx99.99, 99.999%
NICKEL – VANADIUM(Ni)93 (V)07xxx99.95%
TITANIUM – TUNGSTEN(Ti)10 (W)90xxx99.99%
TITANIUM – TUNGSTEN(Ti)15 (W)85xxx99.99%
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SUPERCONDUCTING ALLOYS
YTTRIUM – BARIUM COPPER OXIDE1-2-3xx99.9- 99.999%
BISMUTH – CALCIUM – STRONTIUM – COPPER OXIDE2-2-2-3xx99.9- 99.999%
BISMUTH – LEAD – CALCIUM – STRONTIUM – COPPER OXIDE1.94-0.06-2-2-3xx99.9- 99.999%
THALLIUM – BARIUM – CALCIUM – COPPER OXIDE2-2-2-3xx99.9- 99.999%
ERBIUM – BARIUM – COPPER OXIDE1-2-3xx99.9- 99.999%
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BORIDES
ALUMINUM BORIDEAlB2xxx99%
CHROMIUM BORIDECrB2xxx99.5%
HAFNIUM BORIDEHfB2xxx99.5%
LANTHANUM BORIDELaB6xxx99.5%
MOLYBDENUM BORIDEMo2B5, MoB2xxx99.5%
NIOBIUM BORIDENbB2xxx99.5%
TANTALUM BORIDETaB2xxx99.5%
TITANIUM BORIDETiB2xxx99.5%
TUNGSTEN BORIDEWB, W2Bxxx99.5%
VANADIUM BORIDEVB2xxx99.5%
ZIRCONIUM BORIDEZrB2xxx99.5%
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CARBIDES
BORON CARBIDEB4Cxxx99.5%
CHROMIUM CARBIDECr3C2xxx99.5%
HAFNIUM CARBIDEHfCxxx99.5%
MOLYBDENUM CARBIDEMoCxxx99.5%
NIOBIUM CARBIDENbCxxx99.5%
SILICON CARBIDESiCxxx99.5%
TANTALUM CARBIDETaCxxx99.5%
TITANIUM CARBIDETiCxxx99.5%
TUNGSTEN CARBIDEWCxxx99.95%
VANADIUM CARBIDEVCxxx99.5%
ZIRCONIUM CARBIDEZrCxxx99.5%
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FLUORIDES
ALUMINUM FLUORIDEAlF3xxx99.5%
BARIUM FLUORIDEBaF2xxx99.9%
CALCIUM FLUORIDECaF2xxx99.9%
CERIUM FLUORIDECeF3xxx99.9%
LANTHANUM FLUORIDELaF3xxx99.9%
LEAD FLUORIDEPbF2xxx99.9%
LITHIUM FLUORIDELiFxxx99.9%
MAGNESIUM FLUORIDEMgF2xxx99.9%
SODIUM FLUORIDENaFxxx99.9%
STRONTIUM FLUORIDESrF2xxx99.9%
THORIUM FLUORIDEThF4xxx99.9%
YTTRIUM FLUORIDEYF3xxx99.9%
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NITRIDES
ALUMINUM NITRIDEAlNxxx99.5%
BORON NITRIDEBNxxx99.5%
HAFNIUM NITRIDEHfNxxx99.5%
SILICON NITRIDESi3N4xxx99.9%
TANTALUM NITRIDETaNxxx99.5%
TITANIUM NITRIDETiNxxx99.5%
VANADIUM NITRIDEVNxxx99.5%
ZIRCONIUM NITRIDEZrNxxx99.5%
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OXIDES
ALUMINUM OXIDEAl2O3xxx99.99%
ANTIMONY OXIDESb2O3xxx99.99%
BARIUM TITANATEBaTiO3xxx99.9%
BERYLLIUM OXIDEBeOxxx99.5%
BISMUTH OXIDEBi2O3xxx99.9%
BISMUTH TITANATEBi4TiO3xxx99.9%
CERIUM OXIDECeO2xxx99.99%
CHROMIUM OXIDECr2O3xxx99.9%
DYSPROSIUM OXIDEDy2O3xxx99.9%
ERBIUM OXIDEEr2O3xxx99.9%
EUROPIUM OXIDEEu2O3xxx99.5%
GALLIUM OXIDEGa2O3xxx99.999%
GERMANIUM OXIDEGeO2xxx99.999%
HAFNIUM OXIDEHfO2xxx99.9%
HOLMIUM OXIDEHo2O3xxx99.9%
INDIUM OXIDEIn2O3xxx99.99%
INDIUM TIN OXIDE(In2O3)X (SnO2)1-Xxxx99.99%
IRON OXIDEFe2O3, Fe2O4xxx99.5- 99.9%
LANTHANUM OXIDELa2O3xxx99.99%
LEAD TITANATEPbTiO3xxx99.9%
MAGNESIUM OXIDEMgOxxx99.95%
MANGANESE OXIDEMnO, MnO2, Mn2O3xxx99.9%
MOLYBDENUM OXIDEMoO2, MoO3xxx99.9%
NEODYMIUM OXIDENd2O3xxx99.9%
NICKEL OXIDENiOxxx99.9%
NIOBIUM OXIDENb2O5xxx99.95%
PRASEODYMIUM OXIDEPr2O3xxx99.9%
SAMARIUM OXIDESm2O3xxx99.9%
SILICON DIOXIDESiO2xxx99.995%
SILICON MONOXIDESiOxxx99.9%
STRONTIUM OXIDESrOxxx99.5%
STRONTIUM TITANATESrTiO3xxx99.9%
TANTALUM OXIDETa2O5xxx99.9%
THORIUM OXIDEThO2xxx99.9%
TIN OXIDESnO2xxx99.9%
TIN OXIDE – ANTIMONY OXIDESnO2 – Sb2O3xxx99.9%
TITANIUM OXIDETiO2, Ti2O3xxx99.9%
TUNGSTEN OXIDEWO3xxx99.9%
YTTRIUM OXIDEY2O3xxx99.9%
ZINC OXIDEZnOxxx99.9, 99.99%
ZIRCONIUM OXIDEZrO2xxx99.9%
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SELENIDES
CADMIUM SELENIDECdSexxx99.995%
LEAD SELENIDEPbSexxx99.95%
MOLYBDENUM SELENIDEMoSe2xxx99.9%
NIOBIUM SELENIDENbSe2xxx99.8%
TANTALUM SELENIDETaSexxx99.4%
TUNGSTEN SELENIDEWSe2xxx99.8%
ZINC SELENIDEZnSexxx99.9%
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SILICIDES
ALUMINUM SILICIDEAlSi2xxx99.5%
CHROMIUM SILICIDECrSi2, Cr3Sixxx99.5%
COBALT SILICIDECiSi2xxx99.5%
HAFNIUM SILICIDEHfSi2xxx99.5%
IRON SILICIDEFeSi2xxx99.5%
MOLYBDENUM SILICIDEMoSi2xxx99.5%
NIOBIUM SILICIDENbSi2xxx99.5%
TANTALUM SILICIDETaSi2, TaSi3xxx99.5%
TITANIUM SILICIDETi5Si2, TaSi3xxx99.9%
TUNGSTEN SILICIDEWSi2xxx99.9%
VANADIUM SILICIDEVSi2, V3Sixxx99.5%
ZIRCONIUM SILICIDEZrSi2xxx99.5%
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SULFIDES
ARSENIC SULFIDEAs2S3xxx99.9%
CADMIUM SULFIDECdSxxx99.99%
INDIUM SULFIDEIn2S3xxx99.99%
LEAD SULFIDEPbSxxx99.9%
MOLYBDENUM SULFIDEMoS2xxx99%
TANTALUM SULFIDETaS2xxx99.9%
TUNGSTEN SULFIDEWS2xxx99.8%
ZINC SULFIDEZnSxxx99.99%
ZIRCONIUM SULFIDEZrS2xxx99.9%
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TELLURIDES
CADMIUM TELLURIDECdTexxx99.99%
LEAD TELLURIDEPbTexxx99.99%
MOLYBDENUM TELLURIDEMoTe2xxx99.9%
NIOBIUM TELLURIDENbTe2xxx99.8%
TANTALUM TELLURIDETaTe2xxx99.8%
TUNGSTEN TELLURIDEWTe2xxx99.8%
ZINC TELLURIDEZnTexxx99.99%

 

Sputtering is the thin film deposition manufacturing process at the heart of today’s semiconductors, disk drives, CDs, photovoltaics, flat panel displays, and optical devices.

Semicore Equipment, Inc. is a leading worldwide supplier of sputtering equipment for the electronics, optical, solar energy, medical, automotive, military and related high technology industries. Please allow our support staff to answer any questions you have regarding how to implement the best equipment and techniques for your specific sputtering target needs by contacting us at sales@semicore.com or calling 925-373-8201.

 

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There are several forms of Thin Film Deposition which is a vacuum technology for applying coatings of pure materials to the surface of various objects. The coatings are usually in the thickness range of angstroms to microns and can be a single material, or multiple materials in a layered structure…
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RF or Radio Frequency Sputtering is the technique involved in alternating the electrical potential of the current in the vacuum environment at radio frequencies to avoid a charge building up on certain types of sputtering target materials, which over time can stop the discharge of sputtering atoms terminating the sputtering process…Read More
 

Compared to conventional DC Sputtering, arcing can be greatly decreased or even eliminated by pulsing the DC voltage in the 10–350?kHz range with duty cycles in the 50–90% range.  A Pulsed DC electrical current typically in the few hundreds of volts range is applied to the target coating material. The voltage is either turned off or more frequently reversed with a low voltage short duration cycle to “cleanse” the target of any charge buildup… Read More

Reactive Sputtering is the process of adding a gas like Oxygen or Nitrogen to the vacuum chamber that undergoes a chemical reaction with the coating material before being deposited as a thin film on a substrate… Read More

Semicore Equipment, Inc. can supply all your Sputter Target needs!